Kyambogo University Preamble for the Call for Loan Applications 2020/21

By | June 25, 2020

Dear fellow Country Men and Women,
This is to introduce to you, the Loan Application Form and Loan Application Process that shall be used by Loan Applicants for the Academic
Year 2020/21.
1.0 Background
The Higher Education Students Financing Board (HESFB) was established by an Act of Parliament, No.2 of 2014 as a body corporate, semi-autonomous corporation to provide Loans and Scholarships to students intending to pursue Higher Education in the Country.
The Loans are awarded to students to pursue accredited programmes of study from Higher Education Institutions accredited by National
Council for Higher Education.
2.0 The Call for Loan Applications for Academic year 2020/21
The Higher Education Students’ Financing Board is desirous to call for Loan Applications for the Academic Year 2020/21, but the Health
circumstances resulting from the COVID 19 Pandemic has not yet enabled this to happen, however as soon as it’s possible the Board shall officially publish the call for Loan applications.
3.0 The Loan Application Form 2020/21
The Loan Application has been availed under the Loan Application Mode, through the HESFB website http://www.hesfb.go.ug and clicking
on APPLY NOW a prospective Loan Applicant can start the online application process. Applicants using this window are required to print
the last 3 pages of the Application form, collect the required recommendation signatures, and attach all the required documents in the
Loan Application Form including the Bank pay-in-slip, then submit their application to the nearest Centenary Bank Branch.

4.0 Submission of the Online Loan Application Forms: – On receiving the relevant recommendation signatures, online applicants shall attach all the required documents to the Loan Application
Form together with the Bank pay-in slip of UShs. 53,000 (Uganda Shillings Fifty Three Thousand Only, inclusive of Bank Charges) as
non-refundable Loan processing fee and submit them to the nearest Centenary Bank Branch.
Please note that the Pay-in Bank Slip should be properly kept as it forms first level Loan Application acknowledgement receipt.
Prospective applicants are encouraged to read the application form carefully and put together all the relevant documents as spelt out at
the end of the form as they ponder about what to submit to the Bank.
Please note the following:-
5.0 The approved participating Universities and programmes supported by the Students’ Financing Scheme.
a) The approved participating Universities in the Students’ Loan Scheme in the academic year 2020/21 are the following:-
Table 1:- The Participating Universities

6.0 Students’ Loan Coverage
The Students’ Loan shall cover tuition fees and functional fees. The loan shall also cover Aids and Appliances for persons with disabilities, while research funds may be covered as and when budget allows.
PLEASE NOTE:

  1. The loan shall NOT cover meals, accommodation and other incidental welfare expenses.
  2. Seek for the loan ONLY IF YOU NEED IT.
  3. The Loan Application form shall STRICTLY NOT BE FOR SALE, it’s entirely free but a fully filled loan application form shall be submitted to any Centenary Bank Branch after payment of Ugx. 53,000 (Uganda Shillings Fifty Three Thousand Only inclusive of Bank
    Charges) as
    non-refundable Loan processing fees to HESFB A/C No. 3740300006 with Centenary Bank.
  4. Student loans shall strictly be awarded to students joining the Higher Education Institutions for the first time or students admitted to
    pursue programmes in first year.
  5. Students who shall have been admitted on Government or other merit scholarships shall not be eligible for the Loan Financing
    Scheme.
  6. Applicants shall be informed of the outcome of their applications through the Print media, their respective email addresses, the
    HESFB website, and or via SMS on their private mobile telephone contacts.
  7. Through the different media channels, prospective applicants shall receive official notification to start submitting applications.